STMicroelectronics Industrial Condition Monitoring & Predictive Maintenance Kit

STEVAL-BFA001V2B enables industrial vibration, acoustic, pressure, and temperature monitoring with STM32F469 MCU and IO-Link connectivity.

The STEVAL-BFA001V2B provides a complete solution for industrial condition monitoring and predictive maintenance applications. Designed with an IEC61000-4-2/4 and EN60947 compliant layout, this kit delivers reliable performance in demanding industrial environments.

At the core of the kit is a compact 50 × 9 × 9 mm industrial sensor board suitable for real-world applications. The hardware package includes debugging tools, industrial grade cables, plugs, and adapters, enabling seamless integration into industrial communication networks. A standard multipolar cable manages connections, with one wire dedicated to IO-Link data.

The included STSW-BFA001V2 firmware offers advanced time- and frequency domain signal processing algorithms for vibration monitoring using the high-bandwidth 3D digital accelerometer. It also supports pressure, humidity, temperature, and acoustic emission (AE) sensor data. Firmware runs on the STM32F469AI MCU, an ARM® Cortex®-M4, 32-bit microcontroller, with analysis results displayed on a PC terminal emulator or via the IO-Link master interface.

The kit supports IO-Link device stack v1.1, including IODD support, BLOB transfer for vibration and acoustic FFT data, event generation, and parameter configuration. A dedicated GUI demonstrates full IO-Link device functionality when paired with the STEVAL-IDP004V2 multi-port master evaluation board, enabling rapid prototyping and industrial system testing.

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Kit Contents

Sensor node
Communication adapter board
M12 standard industrial connector
SWD connector for debugging and programming

Features and Benefits

Main supply voltage: 18 - 32 V
Main components of the sensor node:
- 32-bit ARM^® Cortex^®-M4 core for signal processing and analysis (STM32F469AI)
- Ultra-wide bandwidth (up to 6kHz), low-noise, 3-axis digital vibration sensor (IIS3DWB)
- Absolute digital pressure sensor (LPS22HB)
- Relative humidity and temperature sensors (HTS221)
- Digital microphone sensors (IMP34DT05)
- IO-Link PHY device (L6362A)
- EEPROM (M95M01-DF) for data storage
- Step-down switching regulator and LDO regulator (L6984 and LDK220)
- ESD protection (ESDALC6V1-1U2, SMBJ33CA)
Complete set of firmware demo examples based on 3D accelerometer library with advanced frequency and time domain signal processing for predictive maintenance, including:
- Programmable FFT size (256, 512, 1024, 2048), overlapping and averaging
- Programmable windowing (Flat Top, Hanning, Hamming, Rectangular)
- Speed RMS moving average, acceleration max. peak
- Programmable threshold for warning and alarm conditions in spectral band
Microphone algorithms for:
- PDM to PCM
- Sound pressure level (SPL)
- Audio FFT
IO-Link device stack v1.1 protocol and IO-Link Device Descriptor (IODD) for all measurements included (provided by TEConcept GmbH)
M12 standard industrial connector
SWD connector for debugging and programming capability
Reset button
Expansion connector with GPIO, ADC, I²C bus, timer
Designed to meet IEC industrial standard requirements