ARRAYJ-30035-64P-PCB

ON Semiconductor’s range of J−Series SiPM sensors have been used to create high fill−factor, scaleable arrays. The sensors are mounted onto PCB boards with minimal dead space, forming arrays with industry−leading fill factor of up to 90%. The back of each ArrayJ has either one or more multi−way connectors, or a BGA (ball grid array). These allow access to the fast output* and standard I/O from each pixel in the array, and a common I/O from the summed substrates of the pixels. The ArrayJ products with connectors can be used to interface with the user’s own readout via a mating connector, or to a ON Semiconductor Breakout Board (BOB).

• Each SiPM sensor in the array has three electrical connections: fast output, standard output and common
• The substrates (cathodes) of all sensors are summed together to form the common I/O
• Each individual fast output and standard I/O (anode) are routed to its own output pin
• The ARRAYJ−60035−64P is comprised of 64 individual 6 mm J−Series sensors arranged in a 8 x 8 array
• The connections to each array are provided by two Samtec 80−way connectors, type QTE−040−03−F−D−A
• These connectors mate with the Samtec QSE−040−01−F−D−A board−to−board connector and the Samtec EQCD High Speed Cable Assemblies.

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