GF1000SR-00-60-50CC

GF1000SR-00-60-50CC is a Gap Filler 1000SR (two-part) thermally conductive, liquid gap filler material. It features exceptional slump resistance. The mixed system will cure at room temperature and can be accelerated with the addition of heat. Unlike cured thermal pad materials, a liquid approach offers infinite thickness variations with little or no stress to sensitive components during assembly. As cured, Gap Filler 1000SR provides a soft, thermally conductive, form-in place elastomer that is ideal for fragile assemblies or for filling unique and intricate air voids and gaps. Gap Filler 1000SR exhibits low level natural tack characteristics and is intended for use in applications where a strong structural bond is not required.

• Thermal conductivity of 1.0W/m-K
• Excellent slump resistance (stays in place)
• Ultra-conforming, with excellent wet out for low stress interface applications
• 100% solids – no cure by-products
• Excellent low and high temperature mechanical and chemical stability
• No spacer beads
• 60 minutes potentiometer life
• 50.0cc cartridges