65-02-GEL30-0030

65-02-GEL30-0030 is a THERM-A-GAP™ high performance fully cured dispensable gel 30. It is a fully cured dispensable gel designed to eliminate time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. It requires no mixing or curing, providing superior design flexibility. It deflects easily under very low compressive forces, decreasing stress on components thus decreasing component failures. Typical applications include automotive electronic control units (ECUs), power supplies & semiconductors, memory and power modules, microprocessors and graphics processors and flat panel displays & consumer electronics.

• Easily dispensable, fully-cured/no pump out, high bulk thermal conductivity
• Low thermal impedance, ultra low compression force, high tack surface & reworkable
• Provides low thermal impedance at thin and thick gaps, allowing use of common heat spreaders
• Proven reliability in extreme temperature cycling and shock & vibration
• Accommodates a variety of bond line thicknesses for application to multiple devices
• Successfully used to fill a variety of different gap thickness, 10^14ohm-cm volume resistivity
• Compatible with high volume, automated dispense processes, meets Telcordia (Bellcore) silicone specs
• 20grams/min flow rate, 3.1 specific gravity, 2 deflection at pressure, 0.1mm film thickness
• 3.5W/m-K thermal conductivity, 1J/g-K heat capacity, 150ppm/K coefficient of thermal expansion
• 18 months shelf life, operating temperature range from -55 to 200°C